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FC-BGA Substrate Market Size 2026: Top Makers Ranked

Nvidia's plan for 2.5 times more substrate capacity runs through just three suppliers — Ibiden, Unimicron and Samsung Electro-Mechanics — and the Korean one is not in today's FC-BGA top five.

  • No. 1: Ibiden
  • 9 places

01Final list

The leading AIs each built their own list of ten independently. Here is one result that is easy to check: every place has a reason, a source, and the list of AIs that included it.

Order: from most to least AI agreement.

A bright badge means this AI put the entry on its list. A dim badge means it did not.

  1. 1

    Ibiden

    Has the largest committed build: ¥500bn over FY2026–28, and Nvidia named it a partner for an Ono plant reaching 3x capacity from 2028. Its share is disputed: 17%–35%.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 1 · ChatGPT: 1 · Gemini: 1 · MiMo: 1 · StepFun: 1 · DeepSeek: 1 · Wenxin: 1

    What each AI noted 7
    • Claudeplace 1

      It plans ¥500 billion over three years, the clearest 'leader keeps building' story, though its glass-core status is undisclosed in what I found.

      Source ↗
    • ChatGPTplace 1

      A top-tier incumbent is also a direct NVIDIA expansion partner, giving it a stronger combination of current manufacturing experience and forward capacity evidence.

      Source ↗
    • Geminiplace 1

      Controls over 30% of the world's high-end server FC-BGA volume and remains Nvidia's primary packaging substrate anchor, funding aggressive expansion at its Ono plant while developing non-organic core options.

    • MiMoplace 1

      The only substrate maker whose new plant is partly financed by its own customer — Nvidia's advance takes Ono to 3x current capacity with a Q1 2028 ramp.

      Source ↗
    • StepFunplace 1

      The only substrate maker with a JPY 500bn three-year AI plan and an estimated 70–80% of the sold-out high-end ABF market — and Nvidia's 2.5x capacity pledge runs through it.

      Source ↗
    • DeepSeekplace 1

      The Nvidia spec-in leader holds ~35% of FC-BGA and is spending ¥500bn over FY2026-28 to lift AI-server capacity 2.5x — the biggest absolute capex in the industry.

      Source ↗
    • Wenxinplace 1

      Holds ~28% of FC-BGA revenue and has glass-core prototypes — the incumbents' incumbent with the deepest Nvidia ties

    7 AIs put it here
  2. 2

    Unimicron

    A named Nvidia partner, with AI already about 60% of its ABF revenue. Reports put 2026 capex at NT$34bn, NT$53.7bn or NT$64.8bn.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 2 · ChatGPT: 2 · Gemini: 2 · MiMo: 3 · StepFun: 2 · DeepSeek: 4 · Wenxin: 3

    What each AI noted 7
    • Claudeplace 2

      AI-related ABF revenue went from 40% last year to an expected 60% this year, with five-year supply deals funded by prepayments.

    • ChatGPTplace 2

      A leading incumbent with a direct NVIDIA capacity agreement is better positioned than a company whose AI-substrate ambitions remain only a development target.

      Source ↗
    • Geminiplace 2

      The world's largest IC substrate manufacturer by overall square meters, committing tens of billions of NT dollars to high-layer count ABF lines in Taiwan and Thailand while partnering in Corning's glass ecosystem.

    • MiMoplace 3

      It lifted 2026 capex from NT34𝑏𝑛𝑡𝑜𝑁𝑇34bntoNT53.7bn and pushed 80-85% of the increase into ABF — then collected a Nvidia capacity reservation on top.

      Source ↗
    • StepFunplace 2

      AI is already more than 60% of its ABF revenue — and it lifted 2026 capex to a record NT$34bn, then reportedly lifted it again to over NT$53.7bn.

    • DeepSeekplace 4

      Nvidia's capacity-reservation partner in Taiwan is directing ~70% of a record NT$34bn 2026 capex into ABF substrates.

      Source ↗
    • Wenxinplace 3

      ~14% FC-BGA share, building 2027 capacity in Taiwan and Vietnam — the quiet riser co-funded by Google Cloud

      Source ↗
    7 AIs put it here
  3. 3

    Shinko Electric

    No. 2 in high-end FC-BGA by most counts (12–18%) and furthest along on glass, with a 22-layer glass-core substrate. It is also buying JDI's Mobara fab for capacity.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 7 · ChatGPT: 4 · Gemini: 3 · MiMo: 4 · StepFun: 4 · DeepSeek: 3 · Wenxin: 4

    What each AI noted 7
    • Claudeplace 7

      Number two in the Techno Systems Research ranking at 12%, but I found no 2026 capex or glass-core figures for it.

      Source ↗
    • ChatGPTplace 4

      A longstanding advanced-package-substrate supplier belongs in the incumbent group, but the evidence cited here is stronger for current industry standing than for a quantified 2028 AI-capacity ramp.

    • Geminiplace 3

      Forging ahead with a 4.27 trillion won plant in Sejong geared for September 2028 mass production alongside Nvidia co-funding, positioning it as the most aggressive challenger in glass-core substrates.

      Source ↗
    • MiMoplace 4

      It has already built a 22-layer glass-core substrate — 11 copper wiring layers on each side — while sitting inside the five firms holding about 74% of FC-BGA.

      Source ↗
    • StepFunplace 4

      It is converting a whole JDI LCD fab into an AI packaging hub — and it is already showing 22-layer glass substrates.

      Source ↗
    • DeepSeekplace 3

      The #2 FC-BGA supplier (~18%) has the most advanced glass-core prototype — a 22-layer substrate — but its capex is less aggressive than Ibiden's.

      Source ↗
    • Wenxinplace 4

      ~12% FC-BGA share, glass-core R&D since 2024 — the patient Japanese player now accelerating capex

    7 AIs put it here
  4. 4

    AT&S

    Raised 2026/27 capex to €1.0–1.2bn from €400m, backed by long-term deals with AMD and Marvell. It holds about 10% of high-end FC-BGA.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 4 · ChatGPT: 5 · Gemini: 6 · MiMo: 6 · StepFun: 5 · DeepSeek: 5 · Wenxin: 5

    What each AI noted 7
    • Claudeplace 4

      Up to €2 billion in Malaysia, backed by long-term purchase commitments from AMD and one unnamed big-tech buyer.

      Source ↗
    • ChatGPTplace 5

      Its position in the advanced ABF supplier group is strategically important, but capacity announcements only become a competitive advantage when yields and customer volumes follow.

    • Geminiplace 6

      Europe's packaging vanguard opened a €1.7 billion mega-facility in Kulim, Malaysia, dedicated to supplying high-layer FC-BGA substrates to AMD and Intel for HPC platforms.

    • MiMoplace 6

      The only non-Japanese supplier running 10/10 micron lines — and the Kulim ramp that analysts flag as the biggest risk in the table.

      Source ↗
    • StepFunplace 5

      EUR 2bn in Malaysia and a long-term Marvell deal — the only non-Asian name inside the AI substrate build-out, now guiding to 45–55% growth.

      Source ↗
    • DeepSeekplace 5

      AMD's long-term AI substrate partner raised 2026/27 capex to €1.0-1.2bn for Kulim, more than doubling its previous plan.

      Source ↗
    • Wenxinplace 5

      ~10% FC-BGA share, biggest European player, glass-core pilot with Intel — diversifying away from Apple into AI

    7 AIs put it here
  5. 5

    Nan Ya PCB

    Its record 2026 capex of over NT$10bn is about a fifth of revenue, on a roughly 5% FC-BGA share. Management sees the ABF shortage widening in 2027–28.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 5 · ChatGPT: 6 · Gemini: 5 · MiMo: 7 · StepFun: 6 · DeepSeek: 7 · Wenxin: 7

    What each AI noted 7
    • Claudeplace 5

      Its largest-ever capex plan, over NT$10 billion for 2026, is aimed squarely at AI ABF substrates.

      Source ↗
    • ChatGPTplace 6

      A major ABF supplier can gain from high-layer-count server substrates, but the market-share number changes materially when the denominator changes from all substrates to ABF only.

    • Geminiplace 5

      A core pillar of the Formosa Plastics group, leveraging massive chemical supply synergies to expand production of 20-plus layer ABF substrates for cloud AI accelerators.

    • MiMoplace 7

      Daiwa's Taiwan ABF Buy list names it alongside Unimicron and Kinsus — the quiet incumbent inside the 74%.

    • StepFunplace 6

      A record NT$10bn-plus 2026 capex on NT$46.9bn of trailing revenue — and management says the ABF gap widens again in 2027–2028.

      Source ↗
    • DeepSeekplace 7

      Record NT$10bn+ 2026 capex is the largest-ever expansion for a supplier that still holds only ~5% of FC-BGA.

      Source ↗
    • Wenxinplace 7

      ~6% FC-BGA share, parent Formosa Plastics backing gives it capex muscle — glass-core samples expected 2027

    7 AIs put it here
  6. 6

    Kinsus

    Orders are visible into 2028–29, and ABF capacity is modelled to double to 80m units by 2029. Reports put its 2026 capex anywhere from NT$7bn to NT$80bn.

    Included it: Claude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Nemotron.

    In their lists: Claude: 8 · ChatGPT: 7 · Gemini: 8 · MiMo: 8 · StepFun: 7 · DeepSeek: 6 · Wenxin: 6

    What each AI noted 7
    • Claudeplace 8

      Order visibility and capacity planning reach 2028–2029, one of the longest horizons among suppliers.

      Source ↗
    • ChatGPTplace 7

      An established substrate specialist is exposed to the same AI-server opportunity, but public evidence of customer-specific 2028 capacity commitments is less decisive here.

    • Geminiplace 8

      The Pegatron-backed substrate maker is shifting production away from standard mobile BGA toward high-yield AI server FC-BGA lines at its Taoyuan facilities.

    • MiMoplace 8

      The third name in Daiwa's ABF Buy trio — riding high-layer AI-server substrates without the capex headlines of its bigger rivals.

      Source ↗
    • StepFunplace 7

      2025 revenue up 28.9% — the fastest in Taiwan — on a 2026 capex number that sources report anywhere from NT$8bn to NT$80bn.

      Source ↗
    • DeepSeekplace 6

      Nvidia and TSMC's substrate partner has raised 2026 capex twice, to NT$19.6bn, with ABF capacity modeled to grow from 40mn units in 2025 to 80mn by 2029.

      Source ↗
    • Wenxinplace 6

      ~7% FC-BGA share, Hyderabad plant to ship 2027 — co-invested by Microsoft, ramping fast

    7 AIs put it here
  7. 7

    LG Innotek

    A late entrant whose substrate lines ran 94% full. Its AI-server FC-BGA starts in 2027, with a target of $700m in FC-BGA sales by 2030. Small base, big build.

    Included it: Claude, ChatGPT, MiMo, StepFun, DeepSeek, Wenxin. Did not include: Gemini, Nemotron.

    In their lists: Claude: 6 · ChatGPT: 8 · MiMo: see list · StepFun: 10 · DeepSeek: 9 · Wenxin: 8

    What each AI noted 6
    • Claudeplace 6

      Substrate utilization of 94% in H1 2026 and an AI FC-BGA aimed at 2027, though it is a late entrant.

    • ChatGPTplace 8

      It is a relevant package-substrate competitor, but broader component and substrate classifications should not be mistaken for leadership in AI accelerator ABF.

      Source ↗
    • MiMo

      Named differently in its own list: open the full list.

      see list
    • StepFunplace 10

      A $336m 'Dream Factory' chasing $700m of FC-BGA sales by 2030 — server substrates only from 2026, so the 2028 upside is real but the base is tiny.

      Source ↗
    • DeepSeekplace 9

      A 1 trillion won Vietnam FC-BGA plant plus Gumi expansion targets server substrate supply from 2027, making it the fastest-moving Korean challenger after Samsung Electro-Mechanics.

    • Wenxinplace 8

      New entrant with just 3% FC-BGA share but aggressive 1.5 trillion won capex — a long-shot bet on 2028

    6 AIs put it here
  8. 8

    Daeduck Electronics

    FC-BGA is already 26% of revenue, and a 497bn won program, 55% of its equity, is under way. AI-accelerator boards are still forecast at only 44.7bn won (estimate).

    Included it: Claude, ChatGPT, MiMo, DeepSeek, Wenxin. Did not include: Gemini, Nemotron, StepFun.

    In their lists: Claude: 9 · ChatGPT: 9 · MiMo: 9 · DeepSeek: 10 · Wenxin: 9

    What each AI noted 5
    • Claudeplace 9

      Ramping high-value FC-BGA capacity with sharply better margins in H1 2026, but no investment amount was disclosed in what I found.

      Source ↗
    • ChatGPTplace 9

      The investment case is improving AI-server demand and an expected production recovery, but forecast shipments must still convert into sustained profitability.

      Source ↗
    • MiMoplace 9

      Its 2026 AI-accelerator board revenue is forecast at 44.7bn won — about 3% of what Samsung Electro-Mechanics' packaging division booked in one half-year.

      Source ↗
    • DeepSeekplace 10

      FC-BGA is already 26% of revenue and a 213bn-won memory-substrate plant is under construction, but its AI-server share is still small relative to the top five.

    • Wenxinplace 9

      ~2% FC-BGA share but tight Nvidia qualification and 2027 capacity plan — a Korean niche player punching above its weight

      Source ↗
    5 AIs put it here
  9. 9

    Absolics (SKC) glass substrate

    The glass-core pure play: a Georgia plant, AMD and AWS samples, and a 401.1bn won rights offering. First commercial output slipped from end-2026 to 2027.

    Included it: Claude, Gemini, MiMo, StepFun. Did not include: ChatGPT, Nemotron, DeepSeek, Wenxin.

    In their lists: Claude: 10 · Gemini: 9 · MiMo: 10 · StepFun: 8

    What each AI noted 4
    • Claudeplace 10

      It leads on glass but not on volume. First commercial output slipped from end-2026 to 2027, and a 401.1 billion won rights offering is funding qualification.

    • Geminiplace 9

      The dedicated glass-core pioneer operates a $600M plant in Covington, Georgia, backed by Applied Materials to achieve the world's first commercial mass production of glass packaging substrates.

      Source ↗
    • MiMoplace 10

      Three years after the start it finally has samples at AMD and AWS — and still no customer certification, while SKC just injected 290m.

      Source ↗
    • StepFunplace 8

      The world's first dedicated glass-substrate plant, in Georgia, aiming at the first commercial glass cores by end-2026 — with AMD and AWS already testing.

    4 AIs put it here

More about the top three ↓

02More about the top three

The ranking is above. Here is more about the three places at the top: what they are, why they are here, and what is worth knowing.

The three are compared on different yardsticks: Ibiden on planned spending, Unimicron on AI share of sales, Shinko on glass-core progress. Market-share and spending figures also differ between reports.

1Ibiden

No. 1 — Ibiden. On the lists of 7 of 8 AIs; median place there: 1. The AIs ranked it first because it has the biggest committed building plan and the closest tie to Nvidia.

Honsya 03
Kazumax78 · CC BY-SA 3.0 · Wikimedia Commons

Did you know

  • Ibiden did not start with chips. It began in 1912 as Ibigawa Electric Power, built to use the Ibi River for hydroelectric power in Gifu. It moved into carbide in 1917 and took the Ibiden name in 1982.

    Source ↗ ✓ confirmed by several AIs
What it is
Japanese maker of the chip substrates that sit under AI server chips.
Its edge
Biggest committed build: ¥500bn, with Nvidia helping to pay for a new plant.
Who should know
Useful for anyone wondering who will supply AI chips' foundations; shares are disputed.
  • AI readiness for 2028¥500bn over FY2026–28
  • Founded1912

Wikipedia · Wikidata

Why it is here
  • Ibiden's capex plan is ¥500bn (500,000 million yen) for fiscal 2026 to 2028. The first phase, ¥220bn, went to the Gama plant. That makes it a very large build for AI server chip substrates.

  • The second phase is about ¥280bn, the bigger of the two. It adds capacity for high-performance IC package substrates. The upgraded facilities are set to start running in stages from fiscal 2027.

Keep in mind
  • AI chip substrates were about 15% of Ibiden's roughly $2.3 billion revenue. Intel once made up to 90% of its substrate sales and was about 30% by March 2024. Taiwan's Unimicron is trying to win share.

Where to go further
  • Open Ibiden's Integrated Report, the company's yearly report on money and plans. Look first at the spending and factory pages to see how it plans to build capacity for AI-chip parts. Check the cover year, since older editions may appear.

Compare the top three ↓

2Unimicron

No. 2 — Unimicron. On the lists of 7 of 8 AIs; median place there: 2. The AIs put it second because AI is already most of its sales and it is spending heavily, backed by Nvidia.

Did you know

  • Unimicron's 2026 capex was raised to a record NT$34 billion. AI work was 40% of its ABF substrate revenue last year and is expected to reach 60% this year. It expects tight high-end supply through 2028.

What it is
Taiwanese substrate maker that supplies AI server chips.
Its edge
AI is already about 60% of its ABF revenue, a faster shift than the others show.
Who should know
Useful for seeing how fast one supplier is turning toward AI; its spending figures vary.
  • AI readiness for 2028AI ~60% of ABF revenue
  • Founded1990

Wikipedia · Wikidata

Why it is here
  • Unimicron's board raised its 2026 capex budget from NT$34 billion to over NT$53.7 billion. Its budget for equipment with long delivery times rose from NT$14.1 billion to NT$31.6 billion.

History
  • Unimicron started in 1990 as a subsidiary of UMC. It became the world's No. 1 PCB maker in 2009, but in 2012 it slipped to second place, with a 3.7% market share. The article does not say why.

Keep in mind
  • Only Unimicron and Ibiden can make the most advanced ABF substrates, so buyers rely on two suppliers. Approving a new supplier takes years, and ABF film supply is limited, though the article expects that to ease.

Where to go further
  • Read this Taiwan News story on Unimicron's 2026 capital budget. Look first at the NT$34 billion figure and what it funds: ABF substrates, high-end circuit boards and Thailand. Other reports give different numbers, so check the company's own filing.

Compare the top three ↓

3Shinko Electric

No. 3 — Shinko Electric. On the lists of 7 of 8 AIs; median place there: 4. The AIs placed it third because it is furthest along on glass substrates, but its spending looks less bold.

Headquarters of Shinko Electric Industries
アラツク · CC BY-SA 4.0 · Wikimedia Commons

Did you know

  • Shinko was taken private through a bid by JICC-04, a vehicle of JIC Capital. Printing company DNP and chemicals maker Mitsui Chemicals invested alongside it. Competition approvals in Vietnam and China were still pending in August 2024.

What it is
Japanese substrate maker, now privately owned, long a top supplier of advanced chip parts.
Its edge
Furthest on glass: it has shown a 22-layer glass-core substrate.
Who should know
Useful for seeing who may lead the next material shift; no mass-production date yet.
  • AI readiness for 202822-layer glass-core substrate
  • Founded1946

Wikidata

Why it is here
  • Shinko showed a 22-layer glass-core substrate at the Advanced Packaging Summit in July 2026. It has 11 copper wiring layers on each side. This is an early sign of readiness for glass cores.

  • Japanese makers appear to lead South Korean rivals on glass substrates so far. Samsung Electro-Mechanics targets glass core material in the second half of 2027 and finished glass substrates in 2028. Reports say that could slip to 2028 or later.

History
  • Shinko's first business, in February 1946, was recycling household light bulbs. It was reorganized in September 1946 as Shinko Electric Industries. In 1957 Fujitsu Telecommunications Manufacturing took a capital stake to help it enter semiconductors.

Keep in mind
  • Shinko showed a 22-layer glass-core substrate. Its main challenge is "SeWaRe", internal cracking or peeling, which it fights with resin edge reinforcement. The article gives no mass-production date, and DNP targets 2028.

Where to go further
  • Open Shinko's IR library, the page holding its financial documents. Look first at the earnings presentations for new products and factory plans. Expect mostly Japanese text, since Shinko left the Tokyo stock market in June 2025.

Compare the top three ↓

The top three side by side

IbidenUnimicronShinko Electric
In the AIs' lists7 / 87 / 87 / 8
AI readiness for 2028¥500bn over FY2026–28AI ~60% of ABF revenue22-layer glass-core substrate
Founded191219901946
Put first byClaude, ChatGPT, Gemini, MiMo, StepFun, DeepSeek, Wenxin——

Places with the same number of AIs are ordered by their average place in the AIs' own lists.

03Worth knowing

What the AIs noticed while building the list.

Nvidia's 2.5x substrate plan names only Ibiden, Samsung Electro-Mechanics and Unimicron. Shinko, AT&S, Nan Ya and Kinsus hold much of today's market but are not on Nvidia's list.

Noticed by:
Included it: ChatGPT, MiMo, StepFun, DeepSeek. Did not include: Claude, Gemini, Nemotron, Wenxin.
Source ↗

Customers now pay for capacity up front: Nvidia made advances to Ibiden and a reservation with Unimicron, Unimicron signs five-year deals with prepayments, and AT&S has AMD commitments.

Noticed by:
Included it: Claude, MiMo, DeepSeek. Did not include: ChatGPT, Gemini, Nemotron, StepFun, Wenxin.
Source ↗

Glass cores keep slipping: Absolics from end-2026 to 2027, Samsung Electro-Mechanics' venture reportedly to 2028 or later, and Intel's own use to about 2030. Shinko is the one showing a 22-layer part.

Noticed by:
Included it: Claude, StepFun, DeepSeek. Did not include: ChatGPT, Gemini, Nemotron, MiMo, Wenxin.
Source ↗

Substrate plants are already near full: first-half utilisation was 89% at Samsung Electro-Mechanics and 94% at LG Innotek.

Noticed by:
Included it: Claude, MiMo, StepFun. Did not include: ChatGPT, Gemini, Nemotron, DeepSeek, Wenxin.
Source ↗

Ibiden's 'share' depends on what is counted: 17% of FC-BGA, about 35% of high-end, 70–80% of a sold-out segment, or 10.88% of all package substrates.

Noticed by:
Included it: Claude, ChatGPT, StepFun, DeepSeek. Did not include: Gemini, Nemotron, MiMo, Wenxin.
Source ↗

04Questions people ask

what is fc bga substrate

An FC-BGA (flip-chip ball-grid-array) substrate is the multilayer board, built from ABF film, that connects an AI or server chip to the circuit board. The top five suppliers hold about 74% of the market.

Source ↗
fc-bga substrate market size

QYResearch puts it at $5.355bn in 2024, rising to $10.003bn by 2031. Another estimate cited by KED Global gives $8bn in 2022 and $16.4bn by 2030.

Source ↗
who are the biggest fc-bga substrate makers

QYResearch's top five are Unimicron, Ibiden, AT&S, Nan Ya PCB and Shinko, with about 74% combined. Ibiden alone is investing about ¥500bn over FY2026–28.

Source ↗
why do fc-bga market share figures differ

Reports count different things: FC-BGA only, high-end ABF, or all package substrates. That is why Unimicron shows 15.84% of all package substrates but about 14% of high-end FC-BGA.

Source ↗

05How we counted

In plain words, no formulas.

1The question

Top 10 Makers of AI-Chip Base Boards (FC-BGA Substrates): Who Leads Today and Who Is Building for 2028

2Why this topic

A share table lists only today's leaders, and setting it against capex plans, Nvidia qualification and glass-substrate work shows that the board under an AI chip is its own bottleneck, where today's smaller suppliers could matter most by 2028.

3Where it applies

Global AI-chip packaging substrate industry

4What we looked at

  • Share of FC-BGA / ABF substrate revenue
  • Capacity being added for AI servers in 2026-2028, and capex as a share of substrate revenue
  • Qualification on top AI accelerator platforms (Nvidia, AMD) and named big-tech co-funding
  • Glass-core substrate readiness
  • QYResearch (via GII) — FC-BGA supplier ranking: Unimicron, Ibiden, AT&S, Nan Ya PCB and Shinko hold about 74%; market $5.355bn in 2024
  • semi-connect / Techno Systems Research — Company shares of high-end FC-BGA (the figures disagree with each other)
  • Nvidia newsroom — Named substrate partners and capacity reservations behind a 2.5x capacity increase over three years
  • Company capex disclosures (Ibiden, Samsung Electro-Mechanics, AT&S) — Announced investment amounts and start dates for 2026–2028

5Who ranked

The leading AIs, each building its own list of ten independently and naming a source for every place: Claude, ChatGPT, Gemini, Nemotron, MiMo, StepFun, DeepSeek, Wenxin.

6How the places were set

The same entry written differently by different AIs was counted as one. The more AIs put an entry on their list, and the higher they put it, the higher its place. "AI agreement" shows how many of the AIs had it on their own list. Sources are only those the AIs found themselves; nothing was added by hand.

06Each AI's own list

🇺🇸 Claude10 places · 3 notes

The same question, answered by Claude alone. The final list above combines all the AIs.

  1. 1
    Ibiden (Japan)

    It plans ¥500 billion over three years, the clearest 'leader keeps building' story, though its glass-core status is undisclosed in what I found.

    Source ↗
  2. 2
    Unimicron (Taiwan)

    AI-related ABF revenue went from 40% last year to an expected 60% this year, with five-year supply deals funded by prepayments.

  3. 3
    Samsung Electro-Mechanics (Korea)

    6.78 trillion won of FC-BGA capex against a segment that was about 22% of Q2 2026 revenue. That is roughly two years of substrate sales (my arithmetic).

    Source ↗
  4. 4
    AT&S (Austria)

    Up to €2 billion in Malaysia, backed by long-term purchase commitments from AMD and one unnamed big-tech buyer.

    Source ↗
  5. 5
    Nan Ya PCB (Taiwan)

    Its largest-ever capex plan, over NT$10 billion for 2026, is aimed squarely at AI ABF substrates.

    Source ↗
  6. 6
    LG Innotek (Korea)

    Substrate utilization of 94% in H1 2026 and an AI FC-BGA aimed at 2027, though it is a late entrant.

  7. 7
    Shinko Electric (Japan)

    Number two in the Techno Systems Research ranking at 12%, but I found no 2026 capex or glass-core figures for it.

    Source ↗
  8. 8
    Kinsus (Taiwan)

    Order visibility and capacity planning reach 2028–2029, one of the longest horizons among suppliers.

    Source ↗
  9. 9
    Daeduck Electronics (Korea)

    Ramping high-value FC-BGA capacity with sharply better margins in H1 2026, but no investment amount was disclosed in what I found.

    Source ↗
  10. 10
    SKC / Absolics (Korea, glass-core)

    It leads on glass but not on volume. First commercial output slipped from end-2026 to 2027, and a 401.1 billion won rights offering is funding qualification.

What Claude noticed

Samsung Electro-Mechanics' 6.78 trillion won plan (Sejong plus Vietnam) is its largest single-product capex. Sejong output only starts in September 2028, so it is a 2028 bet.

The top five reportedly hold about 74% of FC-BGA, and Samsung Electro-Mechanics is not among them despite the headlines. It is spending to change that.

Glass substrates keep slipping: Absolics from end-2026 to 2027, and Intel's own deployment to about 2030.

🇺🇸 ChatGPT10 places · 2 notes

The same question, answered by ChatGPT alone. The final list above combines all the AIs.

  1. 1
    Ibiden stock (Japan, 2026)

    A top-tier incumbent is also a direct NVIDIA expansion partner, giving it a stronger combination of current manufacturing experience and forward capacity evidence.

    Source ↗
  2. 2
    Unimicron Technology stock (Taiwan, 2026)

    A leading incumbent with a direct NVIDIA capacity agreement is better positioned than a company whose AI-substrate ambitions remain only a development target.

    Source ↗
  3. 3
    Samsung Electro-Mechanics stock (South Korea, 2026)

    The clearest public 2028 manufacturing timetable in this comparison is a Sejong plant with mass production targeted for September 2028.

  4. 4
    Shinko Electric Industries stock (Japan, 2026)

    A longstanding advanced-package-substrate supplier belongs in the incumbent group, but the evidence cited here is stronger for current industry standing than for a quantified 2028 AI-capacity ramp.

  5. 5
    AT&S stock (Austria, 2026)

    Its position in the advanced ABF supplier group is strategically important, but capacity announcements only become a competitive advantage when yields and customer volumes follow.

  6. 6
    Nan Ya PCB stock (Taiwan, 2026)

    A major ABF supplier can gain from high-layer-count server substrates, but the market-share number changes materially when the denominator changes from all substrates to ABF only.

  7. 7
    Kinsus Interconnect Technology stock (Taiwan, 2026)

    An established substrate specialist is exposed to the same AI-server opportunity, but public evidence of customer-specific 2028 capacity commitments is less decisive here.

  8. 8
    LG Innotek stock (South Korea, 2026)

    It is a relevant package-substrate competitor, but broader component and substrate classifications should not be mistaken for leadership in AI accelerator ABF.

    Source ↗
  9. 9
    Daeduck Electronics stock (South Korea, 2026)

    The investment case is improving AI-server demand and an expected production recovery, but forecast shipments must still convert into sustained profitability.

    Source ↗
  10. 10
    Kyocera stock (Japan, 2026)

    Its advanced electronic-packaging capabilities offer a useful diversification angle, but broad ceramic-substrate strength is not equivalent to proven leadership in AI accelerator ABF.

    Source ↗

What ChatGPT noticed

NVIDIA's October 21 announcement names Ibiden, Samsung Electro-Mechanics, and Unimicron and targets a 2.5-times increase in substrate capacity over three years. That is an aggregate target, not evidence that every named supplier will expand by 2.5 times individually.

Glass-core development should be scored as a separate technology pathway. Samsung Electro-Mechanics' joint venture is for glass-core material; material readiness, substrate fabrication, reliability testing, customer qualification, and commercial mass production are different milestones.

🇺🇸 Gemini10 places · 2 notes

The same question, answered by Gemini alone. The final list above combines all the AIs.

  1. 1
    Ibiden (Japan)

    Controls over 30% of the world's high-end server FC-BGA volume and remains Nvidia's primary packaging substrate anchor, funding aggressive expansion at its Ono plant while developing non-organic core options.

  2. 2
    Unimicron (Taiwan)

    The world's largest IC substrate manufacturer by overall square meters, committing tens of billions of NT dollars to high-layer count ABF lines in Taiwan and Thailand while partnering in Corning's glass ecosystem.

  3. 3
    Samsung Electro-Mechanics (South Korea)

    Forging ahead with a 4.27 trillion won plant in Sejong geared for September 2028 mass production alongside Nvidia co-funding, positioning it as the most aggressive challenger in glass-core substrates.

    Source ↗
  4. 4
    Shinko Electric Industries (Japan)

    Maintains an unshakeable lock on tier-1 CPU and custom ASIC flip-chip packaging via proprietary fine-pitch micro-bump tech, backing it up with a 140 billion JPY Nagano expansion.

  5. 5
    Nan Ya PCB (Taiwan)

    A core pillar of the Formosa Plastics group, leveraging massive chemical supply synergies to expand production of 20-plus layer ABF substrates for cloud AI accelerators.

  6. 6
    AT&S (Austria)

    Europe's packaging vanguard opened a €1.7 billion mega-facility in Kulim, Malaysia, dedicated to supplying high-layer FC-BGA substrates to AMD and Intel for HPC platforms.

  7. 7
    Kyocera (Japan)

    Leverages centuries-old ceramic heritage into thermal-resistant packaging, deploying 400 billion yen across Kagoshima plants to manufacture high-reliability FC-BGA modules for AI inference.

    Source ↗
  8. 8
    Kinsus Interconnect Technology (Taiwan)

    The Pegatron-backed substrate maker is shifting production away from standard mobile BGA toward high-yield AI server FC-BGA lines at its Taoyuan facilities.

  9. 9
    Absolics (SKC / USA)

    The dedicated glass-core pioneer operates a $600M plant in Covington, Georgia, backed by Applied Materials to achieve the world's first commercial mass production of glass packaging substrates.

    Source ↗
  10. 10
    Dai Nippon Printing (Japan)

    Combines deep lithography and Through-Glass Via (TGV) expertise to challenge traditional substrate makers with glass-core interposers achieving pitch tolerances below 1 micrometer.

What Gemini noticed

Samsung Electro-Mechanics' joint multi-trillion won capex with Nvidia in Sejong directly challenges Ibiden's historic monopoly on flagship GPU boards by coupling FC-BGA with integrated embedded silicon capacitors.

Absolics and DNP represent disruptive technological wildcards: while traditional leaders defend multi-billion dollar ABF depreciations, pure glass entrants are leapfrogging directly to Through-Glass Via (TGV) architectures for 2028.

🇨🇳 MiMo10 places · 2 notes

The same question, answered by MiMo alone. The final list above combines all the AIs.

  1. 1
    Ibiden(Japan)

    The only substrate maker whose new plant is partly financed by its own customer — Nvidia's advance takes Ono to 3x current capacity with a Q1 2028 ramp.

    Source ↗
  2. 2
    SamsungElectro-Mechanics (South Korea)

    6.78tn won of capex against a packaging division that booked 1.497tn won in six months — Nvidia's slice of its 2028 output is already promised to be a significant portion.

    Source ↗
  3. 3
    Unimicron(Taiwan)

    It lifted 2026 capex from NT34𝑏𝑛𝑡𝑜𝑁𝑇34bntoNT53.7bn and pushed 80-85% of the increase into ABF — then collected a Nvidia capacity reservation on top.

    Source ↗
  4. 4
    ShinkoElectric (Japan)

    It has already built a 22-layer glass-core substrate — 11 copper wiring layers on each side — while sitting inside the five firms holding about 74% of FC-BGA.

    Source ↗
  5. 5
    LGInnotek (South Korea)

    94% utilisation and a chip-embedding substrate that cuts resistance about 25% — but it is still courting Intel and Broadcom rather than shipping AI accelerators.

  6. 6
    AT&S(Austria)

    The only non-Japanese supplier running 10/10 micron lines — and the Kulim ramp that analysts flag as the biggest risk in the table.

    Source ↗
  7. 7
    NanYa PCB (Taiwan)

    Daiwa's Taiwan ABF Buy list names it alongside Unimicron and Kinsus — the quiet incumbent inside the 74%.

  8. 8
    Kinsus(Taiwan)

    The third name in Daiwa's ABF Buy trio — riding high-layer AI-server substrates without the capex headlines of its bigger rivals.

    Source ↗
  9. 9
    DaeduckElectronics (South Korea)

    Its 2026 AI-accelerator board revenue is forecast at 44.7bn won — about 3% of what Samsung Electro-Mechanics' packaging division booked in one half-year.

    Source ↗
  10. 10
    Absolicsglass substrates (SKC, US-Korea)

    Three years after the start it finally has samples at AMD and AWS — and still no customer certification, while SKC just injected 290m.

    Source ↗

What MiMo noticed

Nvidiaplans to lift substrate capacity for its own products 2.5x in three years and is paying suppliers upfront to do it — a multibillion-dollar advance to Ibiden's Ono plant and a capacity reservation for Unimicron's Taiwan expansion.

Glass-coreis the 2028 wildcard and the least proven line in the table: Shinko has a 22-layer glass substrate on the bench, while pure-play Absolics is in its third year without customer certification.

🇨🇳 StepFun10 places · 2 notes

The same question, answered by StepFun alone. The final list above combines all the AIs.

  1. 1
    Ibiden (Japan, 4063)

    The only substrate maker with a JPY 500bn three-year AI plan and an estimated 70–80% of the sold-out high-end ABF market — and Nvidia's 2.5x capacity pledge runs through it.

    Source ↗
  2. 2
    Unimicron (Taiwan, 3037)

    AI is already more than 60% of its ABF revenue — and it lifted 2026 capex to a record NT$34bn, then reportedly lifted it again to over NT$53.7bn.

  3. 3
    Samsung Electro-Mechanics (Korea, 009150)

    Nvidia and Tesla are co-funding its Sejong and Busan lines for September 2028 mass production — and it is already shipping glass-substrate samples to Apple and Broadcom.

    Source ↗
  4. 4
    Shinko Electric Industries (Japan, 6969)

    It is converting a whole JDI LCD fab into an AI packaging hub — and it is already showing 22-layer glass substrates.

    Source ↗
  5. 5
    AT&S (Austria)

    EUR 2bn in Malaysia and a long-term Marvell deal — the only non-Asian name inside the AI substrate build-out, now guiding to 45–55% growth.

    Source ↗
  6. 6
    Nan Ya PCB (Taiwan, 8046)

    A record NT$10bn-plus 2026 capex on NT$46.9bn of trailing revenue — and management says the ABF gap widens again in 2027–2028.

    Source ↗
  7. 7
    Kinsus (Taiwan, 3189)

    2025 revenue up 28.9% — the fastest in Taiwan — on a 2026 capex number that sources report anywhere from NT$8bn to NT$80bn.

    Source ↗
  8. 8
    Absolics / SKC (Korea–US)

    The world's first dedicated glass-substrate plant, in Georgia, aiming at the first commercial glass cores by end-2026 — with AMD and AWS already testing.

  9. 9
    Intel (US)

    A decade of glass work and a 'second half of this decade' promise — the 2028 wild card that is largely building for itself.

    Source ↗
  10. 10
    LG Innotek (Korea, 011070)

    A $336m 'Dream Factory' chasing $700m of FC-BGA sales by 2030 — server substrates only from 2026, so the 2028 upside is real but the base is tiny.

    Source ↗

What StepFun noticed

Nvidia's own capacity release names only three substrate partners — Ibiden, Samsung Electro-Mechanics and Unimicron — for a 2.5x substrate capacity increase, even though Shinko, Nan Ya, Kinsus and AT&S together hold a large slice of the high-end market. Being on Nvidia's letterhead and being on the market-share table are two different lists.

Capex intensity is the real separator: Ibiden's JPY 500bn FY2026–28 plan is the largest single substrate expansion on record, Unimicron lifted 2026 capex twice (NT$34bn to reportedly over NT$53.7bn), while Korea's Daeduck is spending 55% of its entire book equity (KRW 497bn of KRW 897bn) just to re-enter the market.

🇨🇳 DeepSeek10 places · 4 notes

The same question, answered by DeepSeek alone. The final list above combines all the AIs.

  1. 1
    Ibiden (4062.T) — 2026

    The Nvidia spec-in leader holds ~35% of FC-BGA and is spending ¥500bn over FY2026-28 to lift AI-server capacity 2.5x — the biggest absolute capex in the industry.

    Source ↗
  2. 2
    Samsung Electro-Mechanics (009150.KS) — 2026

    A 6.78tn won AI-substrate bet — 4.27tn won in Sejong alone — plus Nvidia's first official Korean substrate partnership; mass production lands September 2028.

  3. 3
    Shinko Electric (6967.T) — 2026

    The #2 FC-BGA supplier (~18%) has the most advanced glass-core prototype — a 22-layer substrate — but its capex is less aggressive than Ibiden's.

    Source ↗
  4. 4
    Unimicron (3037.TW) — 2026

    Nvidia's capacity-reservation partner in Taiwan is directing ~70% of a record NT$34bn 2026 capex into ABF substrates.

    Source ↗
  5. 5
    AT&S (ATS.VI) — 2026

    AMD's long-term AI substrate partner raised 2026/27 capex to €1.0-1.2bn for Kulim, more than doubling its previous plan.

    Source ↗
  6. 6
    Kinsus (3189.TW) — 2026

    Nvidia and TSMC's substrate partner has raised 2026 capex twice, to NT$19.6bn, with ABF capacity modeled to grow from 40mn units in 2025 to 80mn by 2029.

    Source ↗
  7. 7
    Nan Ya PCB (8046.TW) — 2026

    Record NT$10bn+ 2026 capex is the largest-ever expansion for a supplier that still holds only ~5% of FC-BGA.

    Source ↗
  8. 8
    Toppan (7911.T) — 2026

    The Broadcom-backed Singapore FC-BGA plant starts in 2026 and targets 2.5x 2022 capacity by FY2027 — a customer-captive model rather than a merchant-share grab.

    Source ↗
  9. 9
    LG Innotek (011070.KS) — 2026

    A 1 trillion won Vietnam FC-BGA plant plus Gumi expansion targets server substrate supply from 2027, making it the fastest-moving Korean challenger after Samsung Electro-Mechanics.

  10. 10
    Daeduck Electronics (353200.KS) — 2026

    FC-BGA is already 26% of revenue and a 213bn-won memory-substrate plant is under construction, but its AI-server share is still small relative to the top five.

What DeepSeek noticed

The top five hold ~74% of FC-BGA, but the 2028 capacity race is being financed at very different intensities: Ibiden's ¥500bn is about 69% of its electronics-segment revenue, while Samsung Electro-Mechanics' 6.78tn won is roughly 7.5% of its market cap.

Glass-core readiness is not correlated with today's share: Shinko (#2) has a 22-layer glass substrate, while Samsung Electro-Mechanics' GlaSSEM JV slipped to 2028 or later after a failed reliability review.

Nvidia's 2.5x substrate capacity plan is being built through three named partners — Ibiden, Samsung Electro-Mechanics and Unimicron — which together anchor the 2028 AI-server supply chain.

AT&S's Kulim capex of €1.0-1.2bn is more than double its prior €400mn plan, showing that AMD's long-term agreement is a real capacity commitment, not just a qualification headline.

🇨🇳 Wenxin10 places · 2 notes

The same question, answered by Wenxin alone. The final list above combines all the AIs.

  1. 1
    Ibiden 2026 Japan

    Holds ~28% of FC-BGA revenue and has glass-core prototypes — the incumbents' incumbent with the deepest Nvidia ties

  2. 2
    Samsung Electro-Mechanics 2026 Korea

    4.27 trillion won Sejong/Busan bet makes it the #2 FC-BGA house by 2028 — glass-core pilot lines coming online same year

    Source ↗
  3. 3
    Unimicron Technology 2026 Taiwan

    ~14% FC-BGA share, building 2027 capacity in Taiwan and Vietnam — the quiet riser co-funded by Google Cloud

    Source ↗
  4. 4
    Shinko Electric Industries 2026 Japan

    ~12% FC-BGA share, glass-core R&D since 2024 — the patient Japanese player now accelerating capex

  5. 5
    AT&S (Austria Technologie & Systemtechnik) 2026 Austria

    ~10% FC-BGA share, biggest European player, glass-core pilot with Intel — diversifying away from Apple into AI

  6. 6
    Kinsus Interconnect Technology 2026 Taiwan

    ~7% FC-BGA share, Hyderabad plant to ship 2027 — co-invested by Microsoft, ramping fast

  7. 7
    Nan Ya Printed Circuit Board 2026 Taiwan

    ~6% FC-BGA share, parent Formosa Plastics backing gives it capex muscle — glass-core samples expected 2027

  8. 8
    LG Innotek (substrate division) 2026 Korea

    New entrant with just 3% FC-BGA share but aggressive 1.5 trillion won capex — a long-shot bet on 2028

  9. 9
    Daeduck Electronics 2026 Korea

    ~2% FC-BGA share but tight Nvidia qualification and 2027 capacity plan — a Korean niche player punching above its weight

    Source ↗
  10. 10
    Compeq Manufacturing 2026 Taiwan

    ~5% FC-BGA share, glass-core pilot with partners, and 2027 Vietnam line — the Taiwanese dark horse

What Wenxin noticed

Samsung Electro-Mechanics' 4.27 trillion won investment is the single largest substrate-plant commitment announced in 2026 — roughly equal to the combined capex of three smaller Taiwanese rivals, and it is explicitly tied to a 2028 mass-production target.

Big-tech co-funding (Google with Unimicron, Microsoft with Kinsus, Nvidia with Samsung Electro-Mechanics) is becoming a key differentiator — it reduces financial risk and signals platform qualification confidence, but public disclosure is inconsistent across firms.